TAIPEI, May 4 : Taiwanese chip designer MediaTek said it has appointed former TSMC executive Douglas Yu as a part-time adviser as it steps up advanced packaging work and expands into the AI chip market. Here are a few details: • Yu joined TSMC in 1994 and retired in 2025, holding a range of roles in backend research and development. He played a key part in developing TSMC's advanced packaging technologies, including its CoWoS (Chip on Wafer on Substrate). • CoWoS is a key chip packaging