SANTA CLARA, California, April 22 : Taiwan Semiconductor Manufacturing Co plans to open a chip packaging plant in Arizona by 2029, an executive told Reuters. Modern artificial intelligence chips, such as those made by Nvidia, are not single chips but several chips glued together with advanced packaging technologies, a step that has become a supply bottleneck for Nvidia and others. In a January earnings call, TSMC said it was applying for permits to begin construction of its first advanced