US to award HP $50 million for semiconductor tech project
Taiwan
WASHINGTON : The U.S. Commerce Department said Tuesday it plans to award $50 million to HP to support the expansion and modernization of an existing company facility in Oregon that will boost key semiconductor technologies. The proposed funding will support technologies that serve life sciences instrumentation and technology hardware used in artificial intelligence applications and other projects, the department said. Congress in August 2022 approved a $39 billion subsidy program for U.S.
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