An underappreciated step in the chipmaking process is poised to become the next bottleneck for artificial intelligence . Every microchip used to power artificial intelligence must be put into hardware that can interact with the outside world. But right now, almost all of this chipmaking step, known as advanced packaging, happens in Asia, and capacity is in short supply. It's now taking center stage as Taiwan Semiconductor Manufacturing Co. prepares to break ground on two new plants in Arizona