AMSTERDAM :BE Semiconductor Industries (Besi) raised its long-term financial targets ahead of its investor day on Thursday and said it expects to see the benefits of customers adopting its advanced chip stacking tools. The Dutch firm makes the world's most accurate hybrid bonding tool, a critical chip technology allowing multiple chips to be bonded directly on top of each other. AI chip designers Nvidia and Broadcom are looking to adopt a TSMC process using hybrid bonding, Besi's Senior Vice